Here’s What the HDBaseT Alliance is Doing at InfoComm 2025
The HDBaseT Alliance is showcasing its latest technologies for hybrid work and learning environments at InfoComm 2025 in Orlando. At the heart of its booth is a series of live demonstrations featuring how HDBaseT, powered by Valens Semiconductor, enables flexible, high-performance AV and video conferencing setups across a range of room sizes.
Visitors can explore the Valens High Performance Connectivity Zone, which focuses on extending USB-C and USB3 capabilities for high-resolution video and seamless collaboration. Demonstrations include:
- Full-room video conferencing systems with USB-C to USB-C extension
- Scalable infrastructures supporting 4K and USB3 devices
- Meeting configurations featuring multiple displays, cameras, and sources
- Simplified control and connectivity over a single Category cable
A highlight of the booth is a 360° Surround View Experience, a multi-camera demonstration using Valens’ VA7000 chipsets and AI-enhanced imaging to preview applications in immersive entertainment and live events.
Co-exhibitors Acroname, CYP (Cypress Technology), ReThink AV, and TEKVOX will also showcase HDBaseT-compatible solutions, with a focus on USB Type-C connectivity — a rapidly growing standard in modern AV deployments.
The HDBaseT-USB3 specification supports extension of USB 3.2 Gen 1 up to 100 meters (328 feet) over standard Category cable, allowing AV professionals to maintain full performance and resolution in collaborative setups.
At the booth’s Power Wall, attendees can view a wide range of HDBaseT-USB3 products, including PTZ cameras, video bars, room controllers, wallplates, and extenders — providing one of the most complete overviews of HDBaseT applications available at the show.