Valens Semiconductor announced that it will be demonstrating its videoconferencing solutions at InfoComm 2023 that will “enable the evolution of meeting spaces, boosting more inclusive and collaborative videoconferencing setups as per the reality of today’s flexible workplaces.” 80 audiovisual manufacturers will be exhibiting products embedding Valens Semiconductor chipsets, including over a dozen product launches. 

“Today, there are tens of millions of meeting rooms that still need high-speed audio-video equipment to support the hybrid working world and drive productivity within organizations. As a result, multi-camera video conferencing applications is one of the fastest growth areas for audio-video equipment, and Valens Semiconductor is well-positioned to benefit from this growing need in the videoconferencing market,” said Gabi Shriki, SVP, head of audio-video at Valens Semiconductor. “We are excited to once again present technological advancements and new disruptive solutions that provide our customers the reliable and solid connectivity foundation to develop innovative products. The new solutions and products being launched at InfoComm International 2023 by our customers demonstrate their vote of confidence in our offerings.”

“Our commitment to the market is further demonstrated by our upcoming professional grade USB3.2 extension chipset, the VS6320, that is expected to solve the pressing need for extending the many remote USB3.2 peripherals, required in videoconferencing, industrial and medical applications,” concluded Shriki.

Valens Semiconductor says it provides high-performance, cost-effective, flexible connectivity solutions that address the most pressing connectivity challenges the videoconferencing industry is facing – the need to implement systems that support multiple video cameras and video streams in meeting rooms ranging from huddle rooms to small and large conference rooms, and to connect various videoconferencing setups and devices, such as dedicated room PCs or a BYOD (bring-your-own-device), regardless of the participants’ locations, in-person or remote.

To be showcased by Valens Semiconductor at InfoComm 2023:

• The VS3000 allows leading UCC (Unified Communications and Collaboration) equipment manufacturers to design their next generation conferencing solutions, which Valens says provides them the possibility to support and adjust to any meeting setting. This fully integrated chip and its Dual HDBaseT Digital Interface (DHDI) Chip-to-Chip interconnect enable routing and switching of multiple video and USB streams and professional grade high-performance Type-C extension, including multi-stream video over a single category cable.
• Valens Semiconductor will demonstrate the future of multi-camera video solutions with the VA7000, revealed at ISE 2023 and named best-of-show ‘Meeting Equity Demo’ by rAVe pubs. At InfoComm 2023, it will be showcased as a complete reference design, enabling customers faster time-to-market. The VA7000 chipset family extends uncompressed native Camera Serial Interface (CSI-2), “transforming videoconferencing system design, simplifying installations, and lowering total system cost.”

Join Valens Semiconductor will be in the HDBaseT Alliance at booth 3043.